UV Release Tape
- Thickness: As specified
- Color: Transparent
- Temperature Range: As specified
- Adhesion decreases after UV exposure, suitable for wafer grinding and dicing processes.
- Available in multiple brands, with custom processing to meet your dimensional requirements.
- Color: Transparent
- Temperature Range: As specified
- Adhesion decreases after UV exposure, suitable for wafer grinding and dicing processes.
- Available in multiple brands, with custom processing to meet your dimensional requirements.
We provide die-cutting services for UV-release tapes whose adhesion decreases after UV exposure, facilitating removal after wafer grinding and dicing. These tapes are suitable for semiconductor processing applications.
【Processing Case Study】