Wafer Dicing Tape
- Thickness: 0.09–0.20 mm
- Color: Transparent
- Temperature Range: As specified
- High flatness and chemical resistance, suitable for wafer processing and protection.
- Available in multiple brands, with custom processing to meet your dimensional requirements.
- Color: Transparent
- Temperature Range: As specified
- High flatness and chemical resistance, suitable for wafer processing and protection.
- Available in multiple brands, with custom processing to meet your dimensional requirements.
We provide die-cutting services for wafer dicing tapes with high flatness and chemical resistance. These tapes secure and protect wafers during processing, meeting the precision requirements of semiconductor manufacturing.
【Processing Case Study】